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Custom Manufactured Cards

  • Layer 3a – Top External Layer
  • Layer 2a – Printed PVC Foils
  • Layer 1 – Technology Layer
  • Layer 2b – Printed PVC Foils
  • Layer 3b – Back External Layer

Multi-Layer Card Build-Up

RFID cards consist of five layers

  • Two printed PVC foils for the front and back
  • In the middle, is the technology – a layer of foil with the antenna and RFID chip
  • A protective overlay on each side

All 5 layers are pressed together and thus constitute one compact card body

  • Technology, such as contact chips, barcodes, and mag stripes are placed onto the card surface later
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Technology Layer

Choose the technologies you want to use.

125 kHz Prox:
HID
EM
Indala
Hitag (product line)
or Others…

13.56 MHz Smart Cards:
HID iClass
HID Seos
MIFARE Classic
MIFARE DESFire EV3
Legic Prime, Advant & Neon
or Others…

Dual-Interface, Contact and Contactless

Contact Chips:
Java Card Operating Platform
NXP JCOP
Infineon
JCard S
Oracle Java Card
or Others…

Integrate several technologies into a single card.